Die bonders are faster than ever at 42,000 units per hour (UPH) these days. However, the die transfer process is often the limiting time constraint due to the inertia of the mechanical actuators. In addition, the mechanical die ejection physically limits the minimum possible die dimensions. To overcome these limitations we developed a laser-induced on-the-fly bare die bonding technology. Experimental results verify, this technology significantly accelerates the die ejection process and enables up to 108,000 UPH. Further, this technology opens up possibilities for efficient and novel concepts for automatable production, e.g. for flexible ultra-thin wafers.