G.-A. Hoffmann
Al. Wienke
T. Reitberger
J. Franke
S. Kaierle
L. Overmeyer

Thermoforming of planar polymer optical waveguides for integrated optics in smart packaging materials

J. Mater. Process. Tech.
285
116763
2020
Type: Zeitschriftenaufsatz (reviewed)
Abstract
The innovations in smart packaging will open up a wide range of opportunities in the future. This work describes the processing of additive manufactured and planar integrated polymer optical waveguides for use in smart packaging products. The previously published combination of flexographic and Aerosol Jet printing is complemented by thermoforming and thus creates three-dimensional integrated multimode waveguides with optical attenuation of 1.9 dB/cm ± 0.1 dB/cm @ 638 nm. These properties will be the basis to develop smart applications in packaging materials.