O. Haupt
U. Stute

Laser cleaving method using thermal induced stress for FPD's and wafer materials

Conference on Lasers and Electro-Optics (CLEO) and the Quantum Electronics and Laser Science Conference (QELS)
21.-26. Mai
Long Beach
2006
Type: Konferenzbeitrag
Abstract
Cleaving of brittle materials is a non-ablating high potential process based on thermal-induced-stress. Amorphous materials such as glass can be separated as well as crystalline structures using near-infrared laser radiation and multiple absorption technology.