P. von Witzendorff
A. Moalem
R. Kling
L. Overmeyer

Laser dressing of metal bonded diamond blades for cutting of hard brittle materials

J. Laser Appl.
Type: Zeitschriftenaufsatz (reviewed)
In this study, the authors investigate the laser dressing of metal bonded diamond blades by means of laser pulses with different pulse durations and wavelengths. Conventional dressing suffers from excessive blade wear, whereas laser dressing enables precise removal of the bonding metal to generate the required chip space of protruding diamond grains. The challenge for processing this composite material is to find appropriate level of ablation for the bonding metal without damaging the diamond grains through cracking or graphitization. For worn out blades, the influence of pulse duration and wavelength on laser dressed surface topography and bonding metal removal is studied. The experiments are performed with 532 and 1064 nm laser radiation with pulse durations from 12 ps to 20 ns. The blade surface topography and bonding metal removal of the dressed blades are measured with a confocal microscope, where the protruding diamond grains are identified by scanning electron microscope examinations. The dressing results show the bonding metal removal for the available laser sources in the studied pulse duration range, with the increasing number of protruding diamond grains for shorter pulse durations. The results indicate a significant increase of blade lifetime for laser dressed blades compared to conventional dressing methods.