Laser micro-processing
- Melt and burr free precision machining with short-pulse laser (ns-, ps-, fs-Laser)
- Processing of transparent and brittle materials with UV and VUV laser
- Excimer and frequency converted solid state laser(157 nm - 355 nm)
- µm and sub-µm resoltion
- Process technologies:
- Cutting
- Drilling
- 3D structuring
- Surface modification
- Micro stereolithography
- Micro welding
- Wide range of materials
- Metals
- Ceramics
- Glass
- Semiconductors
- Polymers
- crystalline materials
Applications
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Cutting Burr and melt free, arbitrary 3D cutting |
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Drilling High precision, high aspect ratio, minimized thermal impact |
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Stucturing 2.5-dimensional surfaces in brittle materials |
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Stereolithography Generation of arbitary 3D structures |
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Micro systems Slot cutting in silicon for inkjet printer nozzles |
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Electronics Laser welding of electronic components on polymer substrates |
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Surface modification Designed wettability from hydrophobic to hydrophilic |
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Sensors Trimming of gyrometer sensors for anti-skidding control |
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Medicine Bio-degradable stent, machined with a femtosecond laser |
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Automotive engineering Spray hole of an injection nozzle, drilled with a femtosecond laser |
Services
- Fundamental reseaerch
- Feasibility studies
- Process development
- Solutions for manufacturing and production
- System design, construction and implementation
- Consulting