Ultra-short pulsed laser cut stents
Surface structured platinum tubes
Laser material removal from a copper surface
Possibilities for material processing in the micrometer- and nanometer-range bring new applications along with them. The prerequisite for this is normally especially low-damage processing.
This can be accomplished by using ultra-short pulsed laser with pulse lengths shorter than 10 ps. Also, almost any material can be processed. Ultra-short pulse lasers can be used for cutting, drilling or surface structuring. Furthermore, modifications without material removal (in transparent materials, and within the volume) are possible.
The Group Laser Micro-Processing develops, investigates and optimizes processing, including that for industrial applications. The goal is to extend laser material processing into the micro- and nano-range, both in fundamental and application oriented uses. This is done in cooperation with industrial partners and within the framework of publically sponsored projects